Semiconductor Equipm. 19161-12.5 Dicing Tape, Standard, Clear, 12.5" x 330 ft. For Sale
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Semiconductor Equipm. 19161-12.5 Dicing Tape, Standard, Clear, 12.5" x 330 ft.:
$275.00
Semiconductor Equipment Corp 19161-12.5 Dicing Tape, Standard, Clear, Low Tack, 12.5-inch x 330 ft., Clear, 1 RollThickness 100 um / .004”Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.
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