For SAMSUNG S9/S9+ Snapdragon 845 PM845 CPU Chip BGA Stencil IC Reballing Tin For Sale

For SAMSUNG S9/S9+ Snapdragon 845 PM845 CPU Chip BGA Stencil IC Reballing Tin
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For SAMSUNG S9/S9+ Snapdragon 845 PM845 CPU Chip BGA Stencil IC Reballing Tin:
$7.50

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Buyer Pay Attention Please: 1. Tool may have dust or appearance minor defect,it does not affect function. 2. Size we measured may have 1~3mm error,please make sure you do not care. 3. Price does Not include tax. 4. We always declare / write real value to Customs.If you want to declare low value to avoid tax,please leave a message when you make order,thanks! Payment Delivery details Terms of sales About us Contact us Payment We accept PayPal only. We only ship item to your PayPal verified address. Payment must be received within 3 days from the date of purchase. Orders will be processed instantly and dispatched in same day normally, so we do NOT accept any Email/Message note after you place orders. Delivery details We will post to your address,so please make sure your address was correct! if anything wrong,please contact me to correct it before package shipped. response






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